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  • Lead Free Solder, Sn-Ag System,

Lead Free Solder, Sn-Ag System, HS-371

5.00 (2)
Item.#
06611245
Mfr.#
HS-371
Package Qty.
1Roll
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1
28.09 SGD
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Item Feature
Solid Phase/Liquid phase Temperature (degree c)
227/227
Weight (g)
100
Ingredients
Sn:99.3% , Cu+Ni:0.7%
Length (m)
190
Specific Gravity
7.4
Description 2
solder for Impact on the environment oining electronic components that do not contain lead
Wire Diameter (phi mm)
0.3
Customer Reviews
5 star 2
4 star 0
3 star 0
2 star 0
1 star 0
Review Rating: 5.00
2 Customer Reviews
The reviews are automatic translation.
Repair of copper pot
5
From Japan
On 2017-03-13 18:47:58
Convex portion of the inside After fix the dent in the copper pot, but became flat without returning dent of the outside, since the thickness becomes thin, it was filled with the solder. Since the lead-free safe to use.
This review is about item#6611254.
Soldering parts
5
From Japan
On 2015-04-10 13:44:20
We are using it for repair work etc. with attachment of SMD parts of board. There are circumstances that 0.3 mm can be obtained only about this product, but there is no dissatisfaction.
This review is about item#06611245.