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Diamond Wheels (Size Specified)

Diamond wheel (dimension designation) is a grindstone part used for polishing. Diamond wheels that use diamonds with high hardness as abrasive grains are characterized by stable sharpness and are useful for grinding materials that are difficult to cut, such as powdered stainless steel. It is shaped like a disk with a mounting hole in the center, and can be precisely machined by rotating it mounted on a grinding machine. There are various features, such as those with high elastic bond and less sharpening of abrasive grains and excellent sharpness. You can choose from items with dimensions and performance according to the purpose of the work.
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  1. Mold master CBN
    Noritake Mold master CBN
    It is a very sharp CBN resin wheel. Since the holding power of the abrasive grains is high, stable sharpness can be obtained. By adopting a high elastic modulus bond, there is little sinking of abrasive grains and the sharpness is excellent. There are specifications that emphasize sharpness and s... Read More
    Abrasive Grain Size  #170  Diamond Layer Width (X) (mm)  degree of concentration  75  Abrasive  CBC  Suitable Material  High-speed steel, etc. 
    from S$669.90
    Min. 34 days
  2. Master of diamond mold
    Noritake Master of diamond mold
    It is a very sharp diamond wheel. Simultaneous grinding of cemented carbide + steel is also a good thing. Since the abrasive grain holding power is high, stable sharpness can be obtained. By adopting a high elastic modulus bond, there is little sinking of abrasive grains and the sharpness is exce... Read More
    Abrasive Grain Size  #170  Diamond Layer Width (X) (mm)  degree of concentration  75  Binder  Suitable Material  Carbide  Abrasive  SDC 
    from S$589.90
    Min. 34 days
  3. Diamond wheel
    No Brand Diamond wheel
    1A1 type * Because it is made to order, we cannot accept returns. * For separately shipped items, if you order by cash on delivery, it will be shipped the next day or later.
    Outer Diameter (Φmm)  125  Abrasive Grain Size  140~1200  Hole Diameter (Φmm)  19.05~32  Thickness T (mm)  degree of concentration  75  Binder  BW (wet), BD (dry)  Bonding Strength  L (soft), N (medium), P (hard)  back taper  Y (Yes), N (No)  Abrasive Grain  diamond  Commodity condition  ※ There is a reason (unused and opened) 
    Discontinued
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